新闻室

Computex Taipei 2026

Save the Date to join us during Computex Taipei 2026 from June 2-5 at The Place Taipei Hotel, where we’ll have the hotel’s entire 12th floor for demonstrations and meetings.

OCP EMEA Summit 2026

The OCP EMEA Summit serves as a platform where global technical leaders come together to tackle the issues related to data center sustainability, energy efficiency and heat reuse in the region. The focus is on exploring how innovations from hyperscale data center operators can contribute to solving these challenges. The OCP EMEA Summit also highlights deployments of specific OCP-recognized data center equipment in the EMEA region.

Insyde CTO Tim Lewis will be presenting twice during the event:

• Wednesday, April 29, 14:25PM – 14:40PM
  • From Code to Data: Advancing the Unified Platform Configuration Interface (UPCI), with AMI’s Felix Polyudov
• Thursday, April 30th at 09:55AM
  • Shift-Left Firmware Enablement for the Open Chiplet Economy: From Emulation to System-Ready Silicon, where he will be joined by Vincent Casillas from SiPearl and Ravi Narayanaswami from Cadence

VulnCon 2026

Join Insyde at the 2026 Vulnerability Management Ecosystem Collaboration, Ideation, and Action Conference (VulnCon), co-hosted by FIRST and the CVE Program. The conference will be held April 13–16, 2026, at the DoubleTree Resort by Hilton Hotel Paradise Valley – Scottsdale, Arizona, USA.

On April 13th during the FirmVuln26 workshop, Insyde will deliver two sessions focused on practical firmware security implementation:

• Meeting the NSA’s Guidance for Managing UEFI Secure Boot – Kevin Davis, Security Strategist will examine how evolving threats such as BootHole, BlackLotus, and PKFail have driven a shift from static Secure Boot enablement to active key management and policy enforcement, and how InsydeH2O® enables organizations to operationalize these controls and mitigate persistent firmware threats.
• Firmware-Specific Security Guidelines – Tim Lewis, CTO will present a focused framework for identifying and mitigating the most common sources of UEFI firmware vulnerabilities, outlining seven high-risk technology areas and actionable coding practices for large-scale firmware development teams.

Read the announcement about Insyde’s participation here: https://www.insyde.com/news/press-releases/insyde-software-leads-firmware-security-discussions-at-firmvuln26-workshop-during-vulncon-2026/

VulnCon is open to both FIRST members and non-members worldwide who are actively engaged in the vulnerability management space.

Embedded World 2026

Join Insyde Software at Embedded World 2026

Join Insyde Software at Embedded World 2026, taking place March 10–12 in Nuremberg, Germany. We are pleased to once again exhibit with our European distribution partner, Logic Technology, in Hall 4, Booth 4-238.

Enable Intelligent, Next-Generation Embedded Designs

At Embedded World 2026, Insyde will showcase how we help customers accelerate, secure, and manage modern embedded and edge platforms as designs become more intelligent, heterogeneous, and long-lived.

Our production-ready InsydeH2O® UEFI BIOS supports the industry’s latest embedded processors across x86 and Arm architectures, including:

• AMD EPYC™ Embedded 2005 Series – scalable “Zen 5” performance for networking, storage, and industrial workloads
• Intel® Core™ Ultra Series 3 – advanced performance and power efficiency for AI-driven edge and industrial applications
• Qualcomm Dragonwing™ IQ-X Series – high-performance, AI-capable platforms designed for industrial and edge systems

Backed by early silicon engagement, robust development tools, and direct engineer-to-engineer support, Insyde acts as an engineering multiplier, helping teams reduce bring-up risk and hit critical product milestones.

Preparing for EU Cyber Resilience Act (CRA) Requirements

With the EU Cyber Resilience Act (CRA) now in force—and vulnerability reporting obligations beginning in 2026 ahead of full enforcement in December 2027—manufacturers must adopt secure-by-design development practices, manage vulnerabilities throughout the product lifecycle, and provide software transparency.

Visit our booth to learn how Insyde’s security-focused UEFI firmware practices and automated SBOM tooling help manufacturers prepare for CRA requirements, including vulnerability management and machine-readable SBOM generation—without disrupting existing development workflows.

Datacenter-Grade Manageability for the Edge

For customers deploying distributed edge systems, Supervyse® OPF brings datacenter-grade manageability to the edge through a production-ready OpenBMC firmware platform. Supervyse OPF enables out-of-band management, hardware-level telemetry, and remote recovery—supporting secure, observable, and long-lifecycle edge deployments across x86 and Arm architectures.

Visit Us at Embedded World 2026

Stop by Hall 4, Booth 4-238 to speak with Insyde and Logic Technology engineers and learn how we help embedded teams bring up, secure, and manage next-generation platforms.

Arm Unlocked Taipei 2025

Arm Unlocked Taipei 2025 is a new technical AI leadership summit uniting technology companies, silicon partners, and ecosystem leaders to explore the future of AI compute. The event offers exclusive insights into powering scalable, efficient, AI-ready platforms with Arm—from cloud to edge, and hardware to software.

See our presentation:

Telemetry as the Backbone of AI-Ready Infrastructure

As AI workloads scale across cloud and edge environments, the reliability of infrastructure is increasingly tied to continuous, standards-based telemetry. This talk explores how Arm and Insyde are enabling out-of-band telemetry across Arm Neoverse platforms, leveraging Arm CSS, ATD, and SBMR standards to ensure interoperability from silicon to system. Insyde will demonstrate how production-ready UEFI and OpenBMC-based firmware allow operators to simulate, validate, and operationalize telemetry pipelines at fleet scale.

2025 OCP Global Summit

The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software.

Watch Insyde CTO Tim Lewis co-present at OCP:

Defining a Unified Platform Configuration Interface

https://www.youtube.com/watch?v=vvCizPxO0cA

OCP APAC Summit 2025

开放运算计划（Open Compute Project，简称 OCP）正在召集亚太地区社区，于中国台湾台北举办一场为期两天的特别线下峰会，深入探讨当今及未来数据中心基础设施所面临的众多挑战与机遇。

OCP 亚太峰会将展示来自世界各地的最新创新与技术进展。峰会将邀请研究和设计下一代超大规模数据中心设施与基础架构的专家进行演讲，并设有展览，汇聚买家与供应商，共同交流。

OCP EMEA Summit 2025

Join Tim Lewis, Insyde Software CTO and Vincent Casillas, SiPearl VP of Software & Systems R&D, for their presentation at the OCP EMEA Summit:

Embedded World 2025

加入 Insyde Software，参加 2025 年嵌入式世界大会（Embedded World 2025）！我们将与欧洲分销合作伙伴 Logic Technology 一同参展，展位位于 4 号馆，展位号 4-238。

在 Embedded World 2025 上，Insyde Software 将展示我们关键的固件解决方案，助力全球领先的嵌入式企业加速将新一代产品推向市场。InsydeH2O UEFI BIOS 已全面准备就绪，并针对最新的物联网（IoT）和边缘计算平台需求进行了优化，全面支持 Intel 和 AMD 的嵌入式产品路线图。结合我们最新的开发工具和业界领先的工程师对工程师技术支持，客户能够充分释放最新平台在性能、安全性和连接性方面的强大潜力。

如果您想进一步了解如何将基于 OpenBMC 的系统管理功能集成到嵌入式设计中，Supervyse® OPF 提供可靠且安全的系统管理解决方案，采用模块化和可扩展的架构，能够灵活适应嵌入式产品的长期生命周期发展。

Arm Tech Symposia 2024

加入我们的行列，参加 Arm Tech Symposia

在 Arm Tech Symposia 与生态系统内的专业人士交流，参与实践工作坊，并参加由 Arm 领导团队和主要合作伙伴主持的深入研讨课程。这场非凡的活动横跨四大市场、五个城市，推动塑造计算未来的 AI 革命。

Insyde 将参加以下地点的活动：

October 29th, 2024 – Taipei, Taiwan
November 19th, 2024 – Shanghai, China
November 21st, 2024 – Shenzhen, China