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近期产业活动
了解我们的最新产品发布、重要里程碑、战略合作伙伴关系和社区活动
Insyde® Software 领先业界，率先于 Intel® Oak Stream 平台实现业界首次OpenBMC 固件开机
Supervyse® OPF OpenBMC 借由 ASPEED 的新一代 BMC 芯片达成里程碑
阅读公告 >Insyde® Software 推出业界首款支持 骁龙 X 系列平台 PC 的 BIOS 调试解决方案
H2ODDT™ PRO 释放强大调试能力，加速 SNAPDRAGON 平台 PC 的开发进程
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近期产业活动
参加各类展会、会议、网络研讨会、工作坊及其他行业聚会，旨在激发灵感、提供教育并促进产业交流
Computex Taipei '25
Join Insyde Software during Computex Taipei, the world's largest AI & Computer Exhibition.
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Embedded World 2026
Join Insyde Software at Embedded World 2026
Join Insyde Software at Embedded World 2026, taking place March 10–12 in Nuremberg, Germany. We are pleased to once again exhibit with our European distribution partner, Logic Technology, in Hall 4, Booth 4-238.
Enable Intelligent, Next-Generation Embedded Designs
At Embedded World 2026, Insyde will showcase how we help customers accelerate, secure, and manage modern embedded and edge platforms as designs become more intelligent, heterogeneous, and long-lived.
Our production-ready InsydeH2O® UEFI BIOS supports the industry’s latest embedded processors across x86 and Arm architectures, including:
- AMD EPYC™ Embedded 2005 Series – scalable “Zen 5” performance for networking, storage, and industrial workloads
- Intel® Core™ Ultra Series 3 – advanced performance and power efficiency for AI-driven edge and industrial applications
- Qualcomm Dragonwing™ IQ-X Series – high-performance, AI-capable platforms designed for industrial and edge systems
Backed by early silicon engagement, robust development tools, and direct engineer-to-engineer support, Insyde acts as an engineering multiplier, helping teams reduce bring-up risk and hit critical product milestones.
Preparing for EU Cyber Resilience Act (CRA) Requirements
With the EU Cyber Resilience Act (CRA) now in force—and vulnerability reporting obligations beginning in 2026 ahead of full enforcement in December 2027—manufacturers must adopt secure-by-design development practices, manage vulnerabilities throughout the product lifecycle, and provide software transparency.
Visit our booth to learn how Insyde’s security-focused UEFI firmware practices and automated SBOM tooling help manufacturers prepare for CRA requirements, including vulnerability management and machine-readable SBOM generation—without disrupting existing development workflows.
Datacenter-Grade Manageability for the Edge
For customers deploying distributed edge systems, Supervyse® OPF brings datacenter-grade manageability to the edge through a production-ready OpenBMC firmware platform. Supervyse OPF enables out-of-band management, hardware-level telemetry, and remote recovery—supporting secure, observable, and long-lifecycle edge deployments across x86 and Arm architectures.
Visit Us at Embedded World 2026
Stop by Hall 4, Booth 4-238 to speak with Insyde and Logic Technology engineers and learn how we help embedded teams bring up, secure, and manage next-generation platforms.
查看活动详情 >Arm Unlocked Taipei 2025
Arm Unlocked Taipei 2025 is a new technical AI leadership summit uniting technology companies, silicon partners, and ecosystem leaders to explore the future of AI compute. The event offers exclusive insights into powering scalable, efficient, AI-ready platforms with Arm—from cloud to edge, and hardware to software.
See our presentation:
Telemetry as the Backbone of AI-Ready Infrastructure
As AI workloads scale across cloud and edge environments, the reliability of infrastructure is increasingly tied to continuous, standards-based telemetry. This talk explores how Arm and Insyde are enabling out-of-band telemetry across Arm Neoverse platforms, leveraging Arm CSS, ATD, and SBMR standards to ensure interoperability from silicon to system. Insyde will demonstrate how production-ready UEFI and OpenBMC-based firmware allow operators to simulate, validate, and operationalize telemetry pipelines at fleet scale.
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