Taipei, Taiwan – July 28, 2025 –  Insyde Software, a leading provider of UEFI BIOS and OpenBMC-based firmware solutions, today announced its participation as an exhibitor and event sponsor at Taiwan’s first OCP (Open Compute Project) APAC Summit occurring next week from August 5-6 in Taipei.

The Open Compute Project (OCP) is bringing together APAC communities for a two-day, in-person Summit to explore the many challenges and opportunities facing data center infrastructure.

At the OCP APAC Summit, Insyde will demonstrate its cutting-edge UEFI and OpenBMC-based firmware technologies that are designed to boot, secure, and manage OCP projects across today’s most demanding datacenter environments.

The Summit will showcase the latest innovations and technical advancements from around the world, including Insyde’s AI-enhanced OpenBMC technology that aligns with numerous OCP projects and workstreams.

“Insyde Software is proud to support the OCP community and showcase our commitment to standards-based, secure, and innovative firmware for the growing demands of AI and data centers,” said Jeffery Wang, President at Insyde Software.

Visit Insyde Software’s booth (#S14) at the OCP APAC Summit from August 5-6, 2025, at the Taipei Nangang Exhibition Hall 2 (TaiNex2).

About Insyde Software
Insyde Software (www.insyde.com) is a leading worldwide provider of UEFI firmware, OpenBMC-based systems management solutions and custom engineering services for companies in the client PC, data center infrastructure, IoT (Internet-of-Things) and edge computing industries. The company is publicly held (6231.TWO) and headquartered in Taipei, Taiwan with U.S. headquarters in Westborough, MA. The company’s customers include the world’s leading computing, server, communications and storage device designers and manufacturers.

Insyde is a trademark or registered trademark of Insyde Software in the United States and other countries. Other names and brands may be claimed as the property of others.