新聞室

CYBERSEC Taipei 2026

正是在這樣的背景之下，CYBERSEC 2026 臺灣資安大會以「RESILIENT FUTURE」為主題，邀請各界共同凝聚觀點、交流實踐與累積經驗。大會將匯聚全球資安專家與技術團隊，帶來超過 300 場專業演說，CYBERSEC EXPO 資安展更是集結了 400 多家國際資安品牌參與展出，預計吸引 20,000 名以上來自國內外的資安專業人士共襄盛舉。現場同步規劃聚焦在地研發成果的 「臺灣資安館」、賦能專業發展的 「Cyber Talent 資安人才培訓專區」，以及關注智慧聯網與硬體安全的 「AIoT & Hardware Security Zone」，促進跨領域合作與聯防，強化公民、企業到國家的資安韌性。

Computex Taipei 2026

Join us during Computex Taipei 2026 from June 2-5 at The Place Taipei Hotel, where we’ll have the hotel’s entire 12th floor for demonstrations and meetings.

OCP EMEA Summit 2026

The OCP EMEA Summit serves as a platform where global technical leaders come together to tackle the issues related to data center sustainability, energy efficiency and heat reuse in the region. The focus is on exploring how innovations from hyperscale data center operators can contribute to solving these challenges. The OCP EMEA Summit also highlights deployments of specific OCP-recognized data center equipment in the EMEA region.

Insyde CTO Tim Lewis will be presenting twice during the event:

• Wednesday, April 29, 14:25PM – 14:40PM
  • From Code to Data: Advancing the Unified Platform Configuration Interface (UPCI), with AMI’s Felix Polyudov
• Thursday, April 30th at 09:55AM
  • Shift-Left Firmware Enablement for the Open Chiplet Economy: From Emulation to System-Ready Silicon, where he will be joined by Vincent Casillas from SiPearl and Ravi Narayanaswami from Cadence

VulnCon 2026

Join Insyde at the 2026 Vulnerability Management Ecosystem Collaboration, Ideation, and Action Conference (VulnCon), co-hosted by FIRST and the CVE Program. The conference will be held April 13–16, 2026, at the DoubleTree Resort by Hilton Hotel Paradise Valley – Scottsdale, Arizona, USA.

On April 13th during the FirmVuln26 workshop, Insyde will deliver two sessions focused on practical firmware security implementation:

• Meeting the NSA’s Guidance for Managing UEFI Secure Boot – Kevin Davis, Security Strategist will examine how evolving threats such as BootHole, BlackLotus, and PKFail have driven a shift from static Secure Boot enablement to active key management and policy enforcement, and how InsydeH2O® enables organizations to operationalize these controls and mitigate persistent firmware threats.
• Firmware-Specific Security Guidelines – Tim Lewis, CTO will present a focused framework for identifying and mitigating the most common sources of UEFI firmware vulnerabilities, outlining seven high-risk technology areas and actionable coding practices for large-scale firmware development teams.

Read the announcement about Insyde’s participation here: https://www.insyde.com/news/press-releases/insyde-software-leads-firmware-security-discussions-at-firmvuln26-workshop-during-vulncon-2026/

VulnCon is open to both FIRST members and non-members worldwide who are actively engaged in the vulnerability management space.

Embedded World 2026

Join Insyde Software at Embedded World 2026

Join Insyde Software at Embedded World 2026, taking place March 10–12 in Nuremberg, Germany. We are pleased to once again exhibit with our European distribution partner, Logic Technology, in Hall 4, Booth 4-238.

Enable Intelligent, Next-Generation Embedded Designs

At Embedded World 2026, Insyde will showcase how we help customers accelerate, secure, and manage modern embedded and edge platforms as designs become more intelligent, heterogeneous, and long-lived.

Our production-ready InsydeH2O® UEFI BIOS supports the industry’s latest embedded processors across x86 and Arm architectures, including:

• AMD EPYC™ Embedded 2005 Series – scalable “Zen 5” performance for networking, storage, and industrial workloads

• Intel® Core™ Ultra Series 3 – advanced performance and power efficiency for AI-driven edge and industrial applications

• Qualcomm Dragonwing™ IQ-X Series – high-performance, AI-capable platforms designed for industrial and edge systems

Backed by early silicon engagement, robust development tools, and direct engineer-to-engineer support, Insyde acts as an engineering multiplier, helping teams reduce bring-up risk and hit critical product milestones.

Preparing for EU Cyber Resilience Act (CRA) Requirements

With the EU Cyber Resilience Act (CRA) now in force—and vulnerability reporting obligations beginning in 2026 ahead of full enforcement in December 2027—manufacturers must adopt secure-by-design development practices, manage vulnerabilities throughout the product lifecycle, and provide software transparency.

Visit our booth to learn how Insyde’s security-focused UEFI firmware practices and automated SBOM tooling help manufacturers prepare for CRA requirements, including vulnerability management and machine-readable SBOM generation—without disrupting existing development workflows.

Datacenter-Grade Manageability for the Edge

For customers deploying distributed edge systems, Supervyse® OPF brings datacenter-grade manageability to the edge through a production-ready OpenBMC firmware platform. Supervyse OPF enables out-of-band management, hardware-level telemetry, and remote recovery—supporting secure, observable, and long-lifecycle edge deployments across x86 and Arm architectures.

Visit Us at Embedded World 2026

Stop by Hall 4, Booth 4-238 to speak with Insyde and Logic Technology engineers and learn how we help embedded teams bring up, secure, and manage next-generation platforms.

Arm Unlocked Taipei 2025

Arm Unlocked Taipei 2025 is a new technical AI leadership summit uniting technology companies, silicon partners, and ecosystem leaders to explore the future of AI compute. The event offers exclusive insights into powering scalable, efficient, AI-ready platforms with Arm—from cloud to edge, and hardware to software.

Don’t miss our upcoming presentation:

Telemetry as the Backbone of AI-Ready Infrastructure

As AI workloads scale across cloud and edge environments, the reliability of infrastructure is increasingly tied to continuous, standards-based telemetry. This talk explores how Arm and Insyde are enabling out-of-band telemetry across Arm Neoverse platforms, leveraging Arm CSS, ATD, and SBMR standards to ensure interoperability from silicon to system. Insyde will demonstrate how production-ready UEFI and OpenBMC-based firmware allow operators to simulate, validate, and operationalize telemetry pipelines at fleet scale.

2025 OCP Global Summit

The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software.

Watch Insyde CTO Tim Lewis co-present at OCP:

Defining a Unified Platform Configuration Interface

https://www.youtube.com/watch?v=vvCizPxO0cA

OCP APAC Summit 2025

開放運算計畫（Open Compute Project，簡稱 OCP）正在召集亞太地區社群，於台灣台北舉辦一場為期兩天的特別實體高峰會，深入探討當今及未來資料中心基礎設施所面臨的眾多挑戰與機會。

OCP 亞太高峰會將展示來自世界各地的最新創新與技術進展。高峰會將邀請研究與設計下一代超大規模資料中心設施與基礎架構的專家進行演講，並設有展覽，匯聚買家與供應商，共同交流。

OCP EMEA Summit 2025

Join Tim Lewis, Insyde Software CTO and Vincent Casillas, SiPearl VP of Software & Systems R&D, for their presentation at the OCP EMEA Summit:

Embedded World 2025

加入 Insyde Software，一同參加 2025 年嵌入式電子與工業電腦應用展（Embedded World 2025）！我們將與歐洲經銷合作夥伴 Logic Technology 共同參展，展位位於 4 號館，攤位號碼 4-238。

在 Embedded World 2025 展會上，Insyde Software 將展示我們關鍵的韌體解決方案，協助全球領先的嵌入式企業加速將新一代產品推向市場。InsydeH2O UEFI BIOS 已準備就緒，並針對最新的物聯網（IoT）與邊緣運算平台需求進行最佳化，全面支援 Intel 和 AMD 的嵌入式產品藍圖。結合我們最新的開發工具與業界知名的工程師對工程師技術支援，客戶能夠充分發揮最新平台在效能、安全性與連接性方面的強大優勢。

若您有興趣了解如何將基於 OpenBMC 的系統管理功能導入嵌入式設計，Supervyse® OPF 提供可靠且安全的系統管理解決方案，擁有模組化與可擴充的架構，能隨著嵌入式產品的長期生命週期靈活演進。